Product Code: RP-ID-10325394 |
Published Date: 21 Oct 2022 |
Region: NA |
Category: Healthcare & Pharmaceuticals |
Report ID: 10325394
Market Overview:
Flip Chip Technologies Market (By Bumping Technology: Copper Pillar, Solder Bumping, Gold Bumping; By Packaging Technology: By Packaging Type: By industry: By Geography) Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 - 2024
As per the latest report published by Variant Market Research, Global flip chip technologies market is estimated to reach $54 billion by 2024; growing at a CAGR of 9.3% from 2016 to 2024. Flip chip, a semiconductor interconnecting device is commonly used in many electronic products like PCs, smartphones, and medical devices, among others. Flip chip technology offers various benefits such as total package size reduction, reduction in the silicon cost, decrease in signal inductance, and high signal density. Flip chip technology is widely used in various industry verticals such as IT & telecommunication, automotive & transport, electronics, industrial, healthcare, and aerospace and defence, among others.
Major factors driving the global flip chip technologies market are advantages of flip chip technology than the traditional wire bond electrical connection, evolving internet of things, and rising demand for miniaturization & high-performing electronic devices. However, huge initial investment essential to set up new manufacturing plant may hamper the market growth. Furthermore, high acceptance of sensors in electronic devices would unfold with numerous growth opportunities in the forecasted year.
Major segments of the global flip chip technologies market are bumping technology, packaging type, packaging technology, industry vertical, and geography. Bumping technology comprises copper pillar, gold bumping, solder bumping (tin-lead eutectic solder, and lead-free solder), and other bumping technologies (aluminium & conductive polymer). By, packaging type, the market is categorized as flip chip PGA package, flip chip SiP package, flip chip BGA package, flip chip LGA package, and wafer level packaging-CSPnl. Furthermore, the market is sub segmented by packaging technology as 3D IC, 2.5D IC and 2D IC. Industry vertical is further divided into automotive & transport, electronics, industrial, healthcare, IT & telecommunication, aerospace and defence, and other industry verticals (renewable energy and media & entertainment).
Geographically, the global flip chip technologies market is categorized into North America, Europe, Asia-Pacific and RoW. The U.S., Mexico and Canada are covered under North America wherein Europe covers Germany, France, Italy, and Rest of Europe. Asia-Pacific covers China, Japan, South Korea, Taiwan, India, and Rest of Asia Pacific. Rest of the World (RoW) covers South America, Middle East and Africa.
The major players competing in the market are ASE group, Powertech Technology Inc., United Microelectronics Corporation, Intel Corporation, Siliconware Precision Industries Co., Ltd., Amkor Technology, Inc., TSMC, Jiangsu Changjiang Electronics Technology Co., Ltd., Samsung Electronics Co., and Texas Instruments, Inc., among others.
The key takeaways from the report
The report will provide detailed analysis of Flip Chip Technologies Market with respect to major segments such as bumping technology, packaging type, packaging technology, and industry vertical
The report will include the qualitative and quantitative analysis with market estimation over 2015-2022 and compound annual growth rate (CAGR) between 2016 and 2022.
Comprehensive analysis of market dynamics including factors and opportunities.
An exhaustive regional analysis of Flip Chip Technologies Market.
Profile of key players of the Flip Chip Technologies Market, which include key financials, product & services and new developments.
Scope of Flip Chip Technologies Market
Bumping Technology Segments
Copper Pillar
Gold Bumping
Solder Bumping
Tin-lead eutectic solder
Lead-free solder
Other Bumping Technologies (Aluminium & Conductive polymer)
Packaging Type Segments
Flip Chip PGA Package
Flip Chip SiP Package
Flip Chip BGA Package
Flip Chip LGA Package
Wafer Level Packaging-CSPnl
Packaging Technology Segments
3D IC
2.5D IC
2D IC
Industry Vertical Segments
Automotive & Transport
Electronics
Industrial
Healthcare
IT & telecommunication
Aerospace and Defence
Other Industry Verticals (Renewable Energy and Media & Entertainment)
Geographical Segments
North America
US
Canada
Mexico
Europe
Germany
France
Italy
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Taiwan
India
Rest of Asia-Pacific
RoW
South America
Middle East
Africa
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